Development of 3-D Wafer Level Packaging for SAW Filters Using Thin Glass Capping Technology

The introduction of 5G mobile communication created the need to support a large number of radio frequency (RF) bands. This required high performance and reduced size for microacoustic filters. Based on these requirements, a new three-dimensional wafer-level packaging (3-D WLP) solution based on the predecessors' developed technology was presented to resolve reliability issues for surface acoustic wave (SAW) filter packages with large cavities. In the 3-D WLP, vertical interconnects were realized using through glass vias (TGVs). To enable such a process scheme, thin glass caps with TGVs were formed through laser-induced chemical etching. Then, glass capping dies were bonded on the corresponding LiTaO ₃ (LT) device wafer to generate a cavity structure. Partial filling of the vias on the pad was used, and a metal trace was formed on the glass. Ball grid arrays (BGAs) were formed on top of the glass. Finally, an SAW filter WLP was fabricated. This glass capping packaging avoids the outgassing problem of conventional thin-film acoustic packaging at high temperatures, which would cause the contamination of the interdigital transducers (IDTs). In addition, a numerical study based on the 3-D finite element (FE) model has been conducted to analyze the reliability of the package. The built model was applied to perform parametric studies on the effects of package geometry, material properties, and the processing conditions on reliability. Based on the above studies, the optimized SAW filter WLP successfully passed the reliability test of pre-con level 3 and temperature cycling test (TCT, −40 °C ~ 125 °C).