数码产品
印刷电子产品
3D打印
计算机科学
钥匙(锁)
3d打印
纳米技术
电气工程
机械工程
工程类
材料科学
制造工程
计算机安全
作者
Young‐Geun Park,In Sik Yun,Won Gi Chung,Wonjung Park,Dong Ha Lee,Jang‐Ung Park
标识
DOI:10.1002/advs.202104623
摘要
The ability to form arbitrary 3D structures provides the next level of complexity and a greater degree of freedom in the design of electronic devices. Since recent progress in electronics has expanded their applicability in various fields in which structural conformability and dynamic configuration are required, high-resolution 3D printing technologies can offer significant potential for freeform electronics. Here, the recent progress in novel 3D printing methods for freeform electronics is reviewed, with providing a comprehensive study on 3D-printable functional materials and processes for various device components. The latest advances in 3D-printed electronics are also reviewed to explain representative device components, including interconnects, batteries, antennas, and sensors. Furthermore, the key challenges and prospects for next-generation printed electronics are considered, and the future directions are explored based on research that has emerged recently.
科研通智能强力驱动
Strongly Powered by AbleSci AI