残余应力
热固性聚合物
材料科学
微尺度化学
复合材料
固化(化学)
残余物
表征(材料科学)
结构工程
计算机科学
算法
工程类
数学
数学教育
纳米技术
作者
Sagar Shah,Sagar Patil,Christopher J. Hansen,Gregory M. Odegard,Marianna Maiarù
标识
DOI:10.1080/15376494.2021.2017527
摘要
A computational process modeling framework is presented to predict performance-altering residual stress generation at the microscale. A comprehensive material characterization effort is carried out as a function of the resin temperature and curing state, resulting in a novel material database. For a prescribed cure cycle, in-situ elastic modulus evolution, chemical and thermal strains, and random fiber distribution are shown to significantly influence residual stress generation. The results also show that a full process modeling analysis that includes the complete cure cycle (instead of the standard approach of just considering post-processing cool-down) is necessary to accurately predict manufacturing-induced residual stresses.
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