CMOS芯片
电容器
快速回复
静电放电
去耦电容器
电气工程
专用集成电路
电压
材料科学
电子工程
工程类
作者
Ming‐Dou Ker,Chung‐Yu Wu,Cheng Tao,Hun-Hsien Chang
出处
期刊:IEEE Transactions on Very Large Scale Integration Systems
[Institute of Electrical and Electronics Engineers]
日期:1996-09-01
卷期号:4 (3): 307-321
被引量:59
摘要
Capacitor-couple technique used to lower snapback-trigger voltage and to ensure uniform ESD current distribution in deep-submicron CMOS on-chip ESD protection circuit is proposed. The coupling capacitor is realized by a poly layer right under the wire-bonding metal pad without increasing extra layout area to the pad. A timing-original design model has been derived to calculate the capacitor-couple efficiency of this proposed ESD protection circuit. Using this capacitor-couple ESD protection circuit, the thinner gate oxide of CMOS devices in deep-submicron low-voltage CMOS ASIC can be effectively protected.
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