材料科学
有限元法
微电子
超声波
软化
铜
超声波传感器
一致性(知识库)
复合材料
冶金
声学
机械工程
结构工程
光电子学
计算机科学
工程类
物理
人工智能
作者
Hao Huang,Baohua Chang,Dong Du
标识
DOI:10.1179/026708310x12683157551450
摘要
Cu wire is increasingly used in microelectronics packaging manufacturing. In the present paper, the deforming procedure of 100 μm diameter Cu free air balls (FABs) is studied using experimental and finite element (FE) methods. Experimental results show that the superimposed ultrasound can make the Cu FAB softer. Then a non-linear FE model is built to study the deforming process of the Cu FAB. Numerical experiments have been carried out to quantify the effects of superimposed ultrasound on the constitutional model of Cu FABs. An improved power law material model is then established to take into the dynamic acoustic softening effects. A good consistency is achieved in numerically predicted and experimentally obtained deformations of the Cu FAB under various ultrasonic intensities.
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