高电子迁移率晶体管
击穿电压
晶体管
电气工程
物理
光电子学
拓扑(电路)
材料科学
电压
工程类
作者
Ming Xiao,Yunwei Ma,Zhonghao Du,V. Pathirana,Kai Cheng,Ai-Gen Xie,Edward Beam,Yu Cao,Florin Udrea,Hai Wang,Yuxin Zhang
标识
DOI:10.1109/iedm19574.2021.9720714
摘要
This work presents a new device concept, the Multi-Channel Monolithic-Cascode high-electron-mobility transistor (MC 2 -HEMT), which monolithically integrates a low-voltage, enhancement-mode (E-mode) HEMT based on single 2DEG channel and a high-voltage, depletion-mode (D-mode) HEMT based on stacked 2DEG multi-channel. This device can exploit the low sheet resistance of the multi-channel, realize an E-mode gate control, and completely shield the gate region from high electric field. It also obviates the need for nanometer-sized fin-shaped gates used in prior multi-channel HEMTs, thus relaxing the lithography requirement. We experimentally demonstrated the multi-kilovolt AlGaN/GaN MC 2 -HEMTs on a 5-channel wafer with breakdown voltage from 3.45 kV up to over 10 kV. The 10-kV MC 2 -HEMTs show a 1.5-V threshold voltage and a $40\text{-m}\Omega\cdot \text{cm}^{2}$ specific on-resistance, which is $\sim 2.5$ -fold smaller than that of 10-kV SiC MOSFETs and well below the SiC 1-D unipolar limit. To date, this is the first report of $3\text{-kV}+$ E-mode GaN devices, and our MC 2 -HEMTs show the highest Baliga's figure-of-merits in all $6.5\text{-kV}+$ transistors. The MC 2 -HEMT is also applicable to other materials, e.g., (Al)GaO and Al(Ga)N, as a platform design for multi-channel power transistors.
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