材料科学
电磁屏蔽
电磁干扰
电磁干扰
复合材料
导电体
图层(电子)
柔性电子器件
纳米复合材料
聚合物
纳米纤维
复合数
纳米技术
电气工程
工程类
作者
Shengdu Yang,Pengcheng Yang,Chuanzheng Ren,Xiaohai Zhao,Junhua Zhang
标识
DOI:10.1016/j.jcis.2022.04.096
摘要
High-performance conductive polymer nanocomposites containing two-dimensional (2D) MXene are garnering substantial interest for electromagnetic shielding interference (EMI) in flexible electronics. However, owing to the non-sticky nature and undesirable mechanical performances of freestanding MXene film, it remains a formidable challenge to make the trade-off between outstanding EMI shielding capability and high stability. In this study, inspired by the structure and manufacturing process of millefeuille cakes, we propose a controllably layer-by-layer assembling strategy for fabricating flexible multilayered EMI shielding composite films based on MXene and an inherently conductive polymer (ICP). The multilayer films bearing alternating aramid nanofibers/polypyrrole nanowires (AFPy) and Ti3C2Tx reinforced by waterborne polyurethane (Ti3C2Tx@WPU) layers are orderly constructed by a facile alternating vacuum filtration method. Benefiting from the special architectures, the AFPy-70/Ti3C2Tx@WPU-4 film exhibits a high electrical conductivity of 1.74 S cm-1 and superior EMI shielding effectiveness of 40.9 dB at lower Ti3C2Tx loading content (32 wt%). Moreover, synergistic integration of hydrogen bonding and π-π stacks in multilayered films is achieved, especially in tandem with controlled crack generation within the whole film. Excellent EMI shielding performance remains well maintained even after being suffered to back-and-forth bending test (over 10,000 cycles), ultrasonication, and cryogenic temperature, validating great potential as high-performance EMI shielding film resisting extreme conditions.
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