Applications of chemical mechanical planarization (CMP) to More than Moore devices

In addition to the on-going increase in memory capacity and microprocessor performance of devices ("More Moore"), other functionalities like analog/RF devices, passive components, high voltage and power transistors, sensors and actuators (MEMS, MOEMS), or biochips are more and more incorporated to microelectronic systems ("More than Moore"). Chemical-mechanical planarization (CMP), a key manufacturing step enabling the continuation of Moore's Law, is increasingly employed also for the fabrication of "More than Moore" devices. In this chapter, the application of CMP for power transistors, MEMS and micro-opto devices and wafer bonding will be discussed in detail and examples of these devices will be presented.