电感器
CMOS芯片
电气工程
电压
电压调节器
功率(物理)
降压式变换器
瓦片
可靠性(半导体)
电子工程
炸薯条
计算机科学
材料科学
工程类
物理
复合材料
量子力学
作者
Nachiket Desai,Harish K. Krishnamurthy,Khondker Zakir Ahmed,Sheldon Weng,Suhwan Kim,Xiaosen Liu,Trương Thu Hương,Kaladhar Radhakrishnan,Krishnan Ravichandran,James Tschanz,Vivek De
标识
DOI:10.1109/isscc42613.2021.9365957
摘要
High-performance many-core processors and GPUs demand 100s of Watts of power in a single voltage/power domain on chip, operating below 1V. High-frequency and highcurrent-density fully integrated voltage regulators (FIVRs) with in-package air core inductors (ACIs) [1] or on-package magnetic inductors can deliver power with high efficiency and low distribution losses in compact footprints. Multiple FIVR tiles must be “ganged” to support the large on-chip voltage/power domains while meeting the reliability constraints of the active and passive elements, and maintaining high overall efficiency.
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