材料科学                        
                
                                
                        
                            打滑(空气动力学)                        
                
                                
                        
                            镁                        
                
                                
                        
                            剪切(地质)                        
                
                                
                        
                            复合材料                        
                
                                
                        
                            变形(气象学)                        
                
                                
                        
                            分子动力学                        
                
                                
                        
                            临界切应力                        
                
                                
                        
                            单晶                        
                
                                
                        
                            基面                        
                
                                
                        
                            结构工程                        
                
                                
                        
                            结晶学                        
                
                                
                        
                            冶金                        
                
                                
                        
                            热力学                        
                
                                
                        
                            剪切速率                        
                
                                
                        
                            工程类                        
                
                                
                        
                            计算化学                        
                
                                
                        
                            化学                        
                
                                
                        
                            粘度                        
                
                                
                        
                            物理                        
                
                        
                    
                    
            出处
            
                                    期刊:Materials Science Forum
                                                                        日期:2011-02-01
                                                        卷期号:675-677: 949-951
                                                
         
        
    
            
            标识
            
                                    DOI:10.4028/www.scientific.net/msf.675-677.949
                                    
                                
                                 
         
        
                
            摘要
            
            The mechanisms of low-temperature deformation around a crack tip in a hexagonally closed-packed (hcp) magnesium single crystal have been studied by molecular dynamics simulations. In our simulation a {1010} < 12 10 > model I (opening model) crack is selected. The results indicate that slip on the basal plane is activated due to the shear stress at the crack tip. Thus shear banding caused by a successive slip of the basal planes is the main deformation way for this type of crack.
         
            
 
                 
                
                    
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