钝化
材料科学
基质(水族馆)
化学气相沉积
各向同性腐蚀
蚀刻(微加工)
硅
光电子学
单晶硅
等离子体增强化学气相沉积
薄脆饼
图层(电子)
化学浴沉积
分析化学(期刊)
化学工程
纳米技术
薄膜
化学
工程类
地质学
海洋学
色谱法
作者
H. Angermann,E. Conrad,Lars Korte,Jörg Rappich,T. F. Schulze,M. Schmidt
标识
DOI:10.1016/j.mseb.2008.10.044
摘要
The effect of both wet-chemical smoothing and deposition of intrinsic a-Si:H buffer layer on electronic surface and interface properties was investigated for monocrystalline p-type silicon substrates with pyramidal light trapping structures. For the complete removal of native and wet-chemical oxides during the final etching in HF (1%), the treatment time was optimized for each etching step, which leads to a significantly reduced density of rechargeable states on the substrate surface. This density of substrate surface states could be preserved during subsequent deposition of intrinsic and doped a-Si:H buffer layers on the front and back sides by plasma enhanced chemical vapour deposition (PECVD). Solar cells prepared with optimized wet-chemical wafer treatment improved significantly in fill factor. The application of intrinsic buffer layers results in an additional improvement of the open circuit voltage by ∼50 mV, leading to efficiencies enhanced by ∼3% (absolute value) for ZnO/(n,i)a-Si:H/(p)c-Si/(i,p+)a-Si:H/Al cells, as compared to cells with non-optimized substrate treatment and without (i)a-Si:H buffer layers.
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