Flexible multimode sensors based on hierarchical microstructures enable non-destructive grading of fruits in cold chain logistics

材料科学 压电 电极 压力传感器 电阻式触摸屏 微观结构 线性 复合材料 压阻效应 光电子学 图层(电子) 纳米技术 电子工程 计算机科学 机械工程 工程类 化学 物理化学 计算机视觉
作者
Wentao Huang,Jie Xia,Yangfeng Wang,Xinyi Jin,Hongliang Zhu,Xiaoshuan Zhang
出处
期刊:Materials today sustainability [Elsevier BV]
卷期号:25: 100691-100691 被引量:4
标识
DOI:10.1016/j.mtsust.2024.100691
摘要

In practical applications, flexible pressure sensors must demonstrate adequate sensitivity, durability, and the ability to detect both dynamic and static forces across a wide range. The objective of this study is to develop a flexible dual-mechanism piezoelectric/piezoresistive sensor (FDMPS) based on layered microstructures to enable versatile detection in real fruit sorting operations. The FDMPS consists of an upper layer featuring planar MXene electrodes on a PDMS film, a mid-layer comprising microstructured Ag electrodes on a PVDF-TrFE/Silica gel/ZnO film, and a lower layer with microstructured MXene electrodes on a PDMS film composition. To ensure a secure fit, the three-layer structure is treated with APTES and plasma. All electrodes are produced using a pneumatic direct-write process, while the PDMS and piezoelectric films are created via a spin-coating process, making them suitable for large-scale production. The flexible FDMPS, with a 10 wt% ZnO content, achieves an optimal piezoelectric output of 3.6 V. Additionally, the FDMPS demonstrates excellent linearity (0.997), resistive sensitivity (23.65 kpa−1), and stability (5000 cycles). The incorporation of microstructures significantly enhances the performance of piezoelectric/piezoresistive sensing. Moreover, the FDMPS can accurately measure bending strain rate and angle within the ranges of 0–90°/s (with a sensitivity of 0.014 V/(°·s−1)) and 0–110° (with a sensitivity of 0.216/°), respectively. In a wireless, real-time mode, the FDMPS proves effective in monitoring the reciprocating motion of a robotic arm and assessing fruit ripeness during the grading process. This advancement promotes the development and application of precision agriculture and wearable sensing technologies.
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