材料科学
电介质
芳烯
高-κ电介质
纳米复合材料
聚醚酰亚胺
化学工程
复合材料
光电子学
聚合物
烷基
有机化学
化学
芳基
工程类
作者
Jingyu Lin,Xiaohan Wu,Yifan Xia,Lingzhi Nie,Peiyuan Zuo,Puke Mi,Qixin Zhuang
标识
DOI:10.1016/j.surfin.2024.104462
摘要
Polyetherimide (PEI) has great potential as a dielectric because of its high-temperature resistance, but its low energy storage density limits practical applications. Incorporating hafnium dioxide (HfO2) with a moderate dielectric constant (k) and wide bandgap can simultaneously enhance the polarization intensity of PEI and potential barriers for charge injection. Nevertheless, the poor compatibility between HfO2 and PEI inevitably introduces defects, thereby weakening the inhibitory effect on dielectric loss. To tackle this issue, an organic double interface layer is introduced to enhance dielectric performance, where the polar poly(arylene ether urea) (PEEU) containing hydrogen bonds can ensure the layer's compactness. Notably, its non-bonding urea groups serve as deep traps to capture migrating carriers, and the gradient k values of HfO2, PEEU, and PEI help mitigate electric field distortions at the interface, therefore enhancing the suppression of conduction loss. The polarity of PEEU and the introduction of multiple interfaces significantly contribute to an increased k (maximum 9.7, at 1 kHz). At 300 kV mm−1, 5 vol% PEEU@HfO2/PEI achieves a discharged energy density of 3.3 J cm−3 and a high charge-discharge efficiency of 83%, surpassing 5 vol% HfO2/PEI by 1.95 and 2.44 times, respectively. The further COMSOL simulation verifies and proves this work as a novel design strategy for nanocomposite dielectrics.
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