对苯二甲酰氯
玻璃化转变
聚酰亚胺
酰亚胺
热膨胀
聚酰胺
材料科学
高分子化学
氯化物
热分解
聚合物
缩聚物
化学
有机化学
复合材料
冶金
图层(电子)
作者
Jianping Xing,Ge Zhu,Xingzhong Fang,Guofei Chen
摘要
Abstract To meet the needs of high heat‐resistant and colorless polyimide (CPI) films, a series of poly(amide‐imide) (PAI) films were synthesized by copolymerization of 1,2,3,4‐cyclobutanetetracarboxylic dianhydride (CBDA), terephthaloyl chloride (TPC), 4,4′‐(hexafluoroisopropylidene)diphthalic anhydride (6FDA) and 2,2′‐bis(trifluoromethyl)benzidine (TFDB) with the addition of lithium chloride (LiCl) for ionic coordination. The coordination of Li cations with carbonyl groups significantly reduced the coefficient of thermal expansion (CTE) and improved the mechanical properties. Moreover, by adjusting the ratio of CBDA and TPC, all PAI films exhibited high glass transition temperature ( T g ), low CTE and high transparency. Among these PAI films, PAI‐6‐2Li exhibited excellent comprehensive performance with a high T g of 363 °C, low CTE of 6.4 ppm/K, high transmittance of 84% at 400 nm and tensile modulus of 7.2 GPa, which was expected to be used in the field of flexible displays.
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