薄脆饼
新兴技术
半导体工业
可靠性(半导体)
污染控制
介绍(产科)
材料科学
半导体器件制造
纳米技术
制造工程
工程物理
工程类
污染
医学
物理
生态学
功率(物理)
放射科
量子力学
生物
出处
期刊:Solid State Phenomena
日期:2023-08-14
卷期号:346: 3-7
摘要
This presentation focuses on semiconductor wafer cleaning technology, one of the most critical technologies in semiconductor device manufacturing for obtaining high yield and reliability, and discusses the past, present, and future of the technology. Emphasis is placed on the review of contamination control and cleaning technologies in the early days since the invention of the transistor. To celebrate the 30+1-year anniversary of the UCPSS, a review will be given of both the first conference held in Leuven in 1992 and the second one held in Bruges in 1994. There will be more research challenges and business opportunities in environmentally benign, innovative damage-free wafer cleaning and surface preparation technologies for future applications.
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