材料科学
电介质
失效机理
基质（水族馆）
钥匙（锁）
钢化玻璃
复合材料
介电损耗
法律工程学
计算机科学
工程类
光电子学
海洋学
计算机安全
地质学
作者
Qichang An,Yuelei Xiao,Qiuxu Wei,Yifan Wu,Huiying Li,Yue Li
摘要
Due to high insulation, low dielectric loss and low cost, glass is considered as a promising substrate material for advanced package. Through glass via technology plays a key role in the 2.5D and 3D packaging. This paper analyzes failure mechanisms of TGV and discuss the optimum design and process.
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