Effect of heat transfer channels on thermal conductivity of silicon carbide composites reinforced with pitch-based carbon fibers

In this study, silicon carbide (SiC) composites reinforced with pitch-based carbon fibers and composed of heat transfer channels were fabricated by combining chemical vapor infiltration and reactive melting infiltration method. It was observed that the internal heat conduction skeleton of pitch-based carbon fibers was sequentially formed. The thermal conductivities from room temperature to 500 °C along through-thickness direction and in-plane direction were investigated. The results showed that Cpf/SiC composites with heat transfer channels possessed excellent thermal conductvity in two directions, and the thermal conductivity increased with increasing volume content of heat transfer channels. The thermal conductivity in through-thickness direction reached 38.89 W/(m·K), and that for in-plane direction reached 112.42 W/(m·K). Theoretical calculations were empolyed to study the temperature dependence of the Cpf/SiC composites. The variations in slope A′ and intercept B′ values of fitted curves were in good agreement with the experimental results. To verify the reliablilty of the theoretical model, the Cpf/SiC composites were heated at 1650 °C for 2 h and the thermal conductivity exhibited further improvement due to the formation of more perfect crystalline structure. Thermal conductivity through thickness direction improved to 43.49 W/(m·K), and that in in-plane direction improved to 142.49 W/(m·K), which could be identified by the theoretical model. Finally, the leading edge model was established by using ABAQUS finite element analysis software to evaluate the potential application of the composites. Owing to the outstanding thermal conductivity, the leading edge obtained by using Cpf/SiC composites in this study exhibited lower temperature gradient and a more uniform temperature distribution. Moreover, less thermal stress and displacement were generated during heating process.