材料科学
溅射
兴奋剂
薄膜
结晶度
接受者
电导率
旋涂
光电子学
半导体
纳米技术
凝聚态物理
复合材料
物理化学
物理
化学
作者
Fangjuan Geng,Liangjun Wang,Tillmann Stralka,Daniel Splith,Siyuan Ruan,Jialin Yang,Lei Yang,Gang Gao,Liangge Xu,Michael Lorenz,Marius Grundmann,Jiaqi Zhu,Chang Yang
标识
DOI:10.1002/adem.202201666
摘要
Anion doping is an efficient method for modifying the electrical property of the p‐type semiconductor CuI. However, adjustment of the hole density is still challenging. Using sputtering and spin coating techniques, well‐controlled S‐doping of CuI thin films has been realized. The spin‐coated samples present a single (111) out‐of‐plane orientation and very high crystallinity, which is comparable with previously reported epitaxial CuI thin films. The sputtered thin films have advantages in surface morphology and conductivity. Substituting S for I can achieve efficient acceptor doping of CuI for both the physical and chemical growth methods. The highest conductivity of CuI appears at 2.0 at% of S doping, and the doping efficiency is influenced by the self‐compensation effect.
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