基面
材料科学
降级(电信)
质子
碳化硅
光电子学
硅
半导体
纳米技术
化学
电气工程
复合材料
结晶学
物理
量子力学
工程类
作者
Masashi Kato,Shunta Harada,Hitoshi Sakane
标识
DOI:10.35848/1347-4065/ad1779
摘要
Abstract Silicon carbide (SiC) is widely used in power semiconductor devices; however, basal plane dislocations (BPDs) degrade device performance, through a mechanism called bipolar degradation. Recently, we proposed that proton implantation could suppress BPD expansion by reducing BPD mobility. We considered three potential mechanisms: the hydrogen presence around BPDs, point defects induced by implantation, and carrier lifetime reduction. In this study, we discuss the mechanisms of proton implantation and its applicability to SiC power device production.
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