材料科学
离子注入
碳化硅
半导体
硅
退火(玻璃)
工程物理
半导体器件
宽禁带半导体
半导体材料
半导体器件制造
光电子学
纳米技术
冶金
离子
薄脆饼
工程类
物理
量子力学
图层(电子)
作者
Anders Hallén,Margareta K. Linnarsson
标识
DOI:10.1016/j.surfcoat.2016.05.075
摘要
Ion implantation is a key process technique for semiconductor materials, in particular silicon, for local tailoring of the semiconductor properties. The wide bandgap semiconductor silicon carbide (SiC) features outstanding material properties for high power and high temperature electronic devices, but the properties of SiC also make it difficult to manufacture and process the material. The development of implantation technology for SiC has therefore necessitated several changes from mainstream silicon implantation technology. This paper will discuss the difficulties with implantation of SiC for manufacturing of electronic devices and also describe how the problems have been overcome, for instance by implantation at elevated temperatures and using high temperature post-implant annealing.
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