To improve the angiogenesis of endothelial cells on Ti-Cu alloy by the synergistic effects of Cu ions release and surface nanostructure

Peri-implant angiogenesis plays important roles in osseointegration of implants. Unfulfilling neovascularization will lead to delayed union or non-union after prosthetic implanted. In this paper, a nanostructured surface composed of TiO2, CuO and Cu2O was fabricated on Ti-Cu alloy using an alkali-heat treatment. The nanostructure strengthened anticorrosion but accelerated Cu ions release. Meanwhile, in vitro cells experiments proved both Cu ions release and nanostructure on the surface of Ti-Cu alloy improved the functionality of human umbilical vein endothelial cells (HUVECs) resulting in excellent pro-angiogenesis potential indicated by promoted initial adhesion and spreading, satisfied cytocompatibility, enhanced migration, improved tube formation, upregulated angiogenesis-related genes and increased VEGF protein secretion. It was suggested that the modified Ti-Cu alloy with desired angiogenesis might be a promising strategy to improve osseointegration.