材料科学
粒度
铜
加工硬化
冶金
工作(物理)
表面硬化
硬化(计算)
复合材料
热力学
微观结构
硬度
物理
图层(电子)
作者
Chad W. Sinclair,Warren J. Poole,Yves Bréchet
标识
DOI:10.1016/j.scriptamat.2006.05.018
摘要
A model is proposed for the low temperature tensile response of copper polycrystals with grain sizes in the range of 2–50 μm. The initial work hardening behaviour is strongly grain size dependent and is considered to arise from a combination of kinematic and isotropic hardening due to dislocation–grain boundary interactions. At larger strains, the influence of grain size on work hardening disappears owing to processes associated with dynamic recovery at boundaries.
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