锡
兴奋剂
热传导
材料科学
欧姆接触
氧化物
硅
分析化学(期刊)
化学
纳米技术
光电子学
有机化学
图层(电子)
冶金
复合材料
作者
Tsung‐Ming Tsai,Hui‐Chun Huang,Ya‐Hsiang Tai,Dershin Gan,Cong Ye,Hao Wang,Simon M. Sze,Kuan‐Chang Chang,Ting‐Chang Chang,Geng-Wei Chang,Yong-En Syu,Yu‐Ting Su,Guan-Ru Liu,Kuo-Hsiao Liao,Min-Chen Chen
标识
DOI:10.1109/led.2012.2217932
摘要
In this letter, we investigate the origin of hopping conduction in the low-resistance state (LRS) of a resistive random access memory device with supercritical CO 2 fluid treatment. The dangling bonds of a tin-doped silicon oxide ( Sn:SiO x ) thin film were cross linked by the hydration-dehydration reaction through supercritical fluid technology. The current conduction mechanism of the LRS in the posttreated Sn:SiO x thin film was transferred to hopping conduction from Ohmic conduction, owing to isolation of metal tin in the Sn:SiO x thin film by hydration-dehydration reaction. The phenomena can be verified by our proposed reaction model, which is speculated by the X-ray photoelectron spectroscopy analyses.
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