材料科学
铜
钛
基质(水族馆)
图层(电子)
化学工程
纳米复合材料
离子
结晶
冶金
表层
离子键合
复合材料
化学
有机化学
工程类
地质学
海洋学
作者
В. П. Сергеев,Marina V. Fedorischeva,V. V. Neufeld,М. П. Калашников
出处
期刊:Advanced Materials Research
日期:2014-01-01
卷期号:880: 184-189
被引量:5
标识
DOI:10.4028/www.scientific.net/amr.880.184
摘要
Processing of copper substrates by Ti ions was carried out using «KVANT-03MI» equipment by means of a vacuum-arc ionic source with the titanium cathode. By X-ray and SEM methods it was established that after ionization in the surface layer of substrate the intermetallides of Cu-Ti system form. There is the CuTi 3 preferred phase in surface layer of substrate depending on time of processing by Ti ions. The mechanism of formation of observable net structure of surface layer by sputtering of copper atoms by Ti ions the subsequent deposition and their crystallization in the form of microislets of CuTi 3 intermetallide on surface of a copper substrate have been suggested.
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