电阻率和电导率
累积滚焊
材料科学
铝
微观结构
晶界
位错
冶金
扫描电子显微镜
透射电子显微镜
晶格常数
复合材料
衍射
凝聚态物理
光学
纳米技术
电气工程
工程类
物理
作者
Yoji Miyajima,S Komatsu,Masatoshi Mitsuhara,Satoshi Hata,Hideharu Nakashima,Nobuhiro Tsuji
标识
DOI:10.1080/14786435.2010.510453
摘要
Commercial purity aluminium sheets were severely plastic deformed by accumulative roll bonding (ARB). Changes in electrical resistivity at 77 K and microstructure during the ARB process were traced up to 12 cycles, which corresponded to an equivalent strain of 10. The resistivity at 77 K increased with increasing number of ARB cycles, then saturated after about the sixth ARB cycle with a maximum increment of resistivity from starting material of about 1.1 nΩ m. Since lattice defects affect the resistivity of metals, the internal dislocation density and the density of grain boundaries were evaluated from scanning transmission electron microscopy images using Ham's method and grain boundary maps obtained from electron back-scattering diffraction, respectively. The relationship between the change in resistivity and the lattice defects is discussed.
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