材料科学
激光器
焊接
二极管
激光束焊接
机械加工
光电子学
包层(金属加工)
硬化(计算)
抛光
复合材料
光学
冶金
物理
图层(电子)
标识
DOI:10.1016/s0143-8166(00)00066-x
摘要
This paper presents a review of the direct applications of high-power diode lasers for materials processing including soldering, surface modification (hardening, cladding, glazing and wetting modifications), welding, scribing, sheet metal bending, marking, engraving, paint stripping, powder sintering, synthesis, brazing and machining. The specific advantages and disadvantages of diode laser materials processing are compared with CO2, Nd:YAG and excimer lasers. An effort is made to identify the fundamental differences in their beam/material interaction characteristics and materials behaviour. Also an appraisal of the future prospects of the high-power diode lasers for materials processing is given.
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