吸附
曲率
平面的
再分配(选举)
电化学
材料科学
电解质
化学物理
制作
机制(生物学)
纳米技术
化学工程
化学
计算机科学
电极
物理
几何学
物理化学
数学
工程类
医学
计算机图形学(图像)
替代医学
病理
量子力学
政治
政治学
法学
作者
Thomas P. Moffat,Daniel Wheeler,Daniel Josell
出处
期刊:ECS transactions
[The Electrochemical Society]
日期:2008-05-09
卷期号:13 (2): 129-137
被引量:9
摘要
The mechanism and modeling of superconformal film growth used in the electrochemical fabrication of 3-D Cu interconnects is briefly reviewed. The central role of electrolyte additives in controlling feature filling is fully described by the curvature enhanced adsorbate coverage (CEAC) mechanism developed at NIST. The key feature of the CEAC mechanism is redistribution of adsorbed additives through changes of local surface area as dictated by mass conservation and the relative strengths of adsorption. By examining the competition between rate suppressing, accelerating and deactivating adsorbates on planar surfaces the CEAC enables detailed prediction of shape evolution during electrodeposition on 3-D patterned surfaces that are found to be in excellent agreement with feature filling experiments.
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