Advanced numerical analysis of convective rarefied flows in microchannels: Studying the impact of multiple obstacle arrangements through LBM modeling

微通道 机械 努塞尔数 格子Boltzmann方法 传热 努森数 材料科学 流体力学 计算流体力学 温度跃变 稀薄(生态学) 物理 雷诺数 地质学 古生物学 物种丰富度 湍流
作者
Siham Hammid,Khatir Naima,Younes Menni,Cheikh Kezrane,Abdelkrim Liazid,Ayad Q. Al-Dujaili,Ahmed Ibraheem Abdulkareem,Amjad J. Humaidi,Sarah Jawad Shoja
出处
期刊:Modern Physics Letters B [World Scientific]
卷期号:37 (27) 被引量:1
标识
DOI:10.1142/s0217984923500999
摘要

The investigation of fluid flow and forced convective heat transfer in microchannels with square barriers is the focus of this study. The positioning of obstacles was varied in three cases: at the top wall, bottom wall, and symmetrically distributed on both sides of the microchannel wall. The thermal Lattice Boltzmann Method in conjunction with the Double Distribution Function and Bhatnagar–Gross–Krook approach was used for simulation through computer code in Python. Slip velocity and temperature jump were considered in the boundary conditions for the walls of the microchannel and obstacles. The results demonstrate that the rarefaction effect, placement of barriers, and choice of square obstacles significantly impact fluid flow and heat transfer. An increase in Knudsen numbers (Kn) leads to a decrease in temperature and velocity. The presence of obstructions on both sides of the microchannel walls reduces the fluid’s velocity and cools the fluid at the microchannel’s exit. The third case, with obstacles on both sides, presents a practical approach for reducing the fluid’s temperature at the exit, resulting in the lowest level of skin friction (Cf) and a reduction in the Nusselt number (Nu). The proposed configurations can be utilized to enhance the geometry of microchannels and for cooling purposes in small-scale devices and systems with miniature mechanical and electrical components. The study’s findings suggest that the placement of obstacles at the bottom or on both sides, depending on the need for best cooling on both sides or only at the top to reduce material consumption, can achieve low temperature at the exit of a rectangular microchannel.

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