Special hot working plastic deformation behavior and microstructure evolution mechanism of single-phase BCC structure AlFeCoNiMo0.2 high-entropy alloy

微观结构 合金 材料科学 高熵合金 成形性 热加工 应变率 变形机理 下部结构 变形(气象学) 晶界 动态再结晶 大气温度范围 热力学 冶金 复合材料 物理 结构工程 工程类
作者
Jianlin Li,Ge Zhou,Jinke Han,Haoyu Zhang,Yuhan Peng,Lijia Chen,Xue Cao,Peter K. Liaw
出处
期刊:Journal of Alloys and Compounds [Elsevier]
卷期号:955: 170149-170149 被引量:8
标识
DOI:10.1016/j.jallcom.2023.170149
摘要

The single-phase body-centered cubic (BCC) structured high-entropy alloys are considered to be typically difficult-to-deform processing alloy because they can still crack during hot deformation at high temperatures and low strain rates. However, we found that the hot working formability of this type of alloy is very sensitive to temperature, and there is a unique microscopic transformation. In this paper, the as-cast single-phase BCC-structured AlFeCoNiMo0.2 high-entropy alloy was investigated with the single-pass hot-compression simulation experiment (deformation of 0.6), at temperatures and strain-rate ranges of 900 – 1150 ℃ and 0.001 – 0.1 s−1, respectively. The hot-deformation behavior and microstructure-evolution mechanisms were studied. The Arrhenius constitutive relation model was revised and established. The processing maps of Prasad, Gegel, Malas, and Murty with different instability criteria were constructed. The optimal thermal-processing parameters (temperatures of 1070 – 1150 ℃ and strain rates of 0.001 – 0.1 s−1) were provided. It was great to find that the alloy has a narrow temperature window effect of hot working with the Ruano-Wadsworth-Sherby (R-W-S) deformation-mechanism map established by incorporating the dislocation quantity. The deformation mechanisms of the alloy at 900 °C, 1000 °C, 1050 °C, and 1100 °C were predicted. The single-phase (BCC) structure of the alloy has strong stability during hot deformation. In a narrow range of hot-working temperatures, the microstructure has a necklace-like structure, and its substructure has a strong textured effect, impeding grain-boundary slip. In the optimized processing interval, discontinuous dynamic recrystallization (DDRX) occurs, and the necklace-like structure disappears. The recrystallization mechanism is related to grain-boundary sliding, caused by dislocation sliding.
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