多核处理器
太比特
计算机科学
波分复用
网络拓扑
芯(光纤)
多路复用
纤维
计算机网络
计算机体系结构
材料科学
并行计算
电信
光电子学
波长
复合材料
作者
Ruben S. Lúıs,Benjamin J. Puttnam,Georg Rademacher,Satoshi Shinada,Tetsuya Hayashi,Tetsuya Nakanishi,Yuki Saito,Tetsu Morishima,Hideaki Furukawa
出处
期刊:Journal of Optical Communications and Networking
[The Optical Society]
日期:2023-02-03
卷期号:15 (7): C41-C41
被引量:7
摘要
This work demonstrates the use of spatial division multiplexing (SDM) to implement spine-leaf datacenter network topologies. We consider two possible scenarios, with the first consisting of the direct use of high-capacity multicore fiber interconnects. This was implemented with an 8-core multicore fiber to support 64×200Gb/s SDM wavelength division multiplexing (WDM) lanes and combined throughput of 12.8 Tb/s. We also demonstrate a scenario in which each multicore fiber interconnect is used to establish multiple connections between pairs of spin-leaf switches. An optical circuit switch is used between the spine and leaf layers to establish core-selective connections, which significantly reduces the number of cables required to implement the network. We demonstrate this approach with a commercial optical circuit switch and 8-core and 4-core multicore fiber interconnects.
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