材料科学
高熵合金
合金
微观结构
熔点
体积分数
固溶体
电阻率和电导率
热力学
相(物质)
冶金
复合材料
物理
电气工程
工程类
化学
有机化学
作者
Jing Bai,Zhong Wang,Min Zhang,Junwei Qiao
标识
DOI:10.1002/adem.202201831
摘要
One major hindrance that now‐available low‐melting‐point alloys (LMPAs) for extensive applications is the limitation of cost and electroconductivity. GaInSnZn x high‐entropy alloys (HEAs) feature tunable solid–liquid phase transitions and are synthesized via induction melting, whose microstructural evolution and electrical properties are investigated by changing the composition. A sweepthrough composition space indicates these alloys are a mixed multiphase microstructure of low‐melting‐point near‐liquid Ga‐based solid solution and other relatively high‐melting‐point phases throughout, which is considered as the origin of stiffness transition of alloys. Varying molar amounts of Zn from 1 to 3, the volume fraction of Zn‐based solid‐solution phase gradually increases and its morphology changes from rod shape to island‐like structure. The electroconductivity keeps a continuous increment from 4.68 to 6.35 MS m −1 , and in consideration of cost, these alloys have remarkable superiority over many LMPAs. The virgation between the electrical experimental and theoretical values computed using the volume model and multiphase alloy model is thoroughly elaborated, in which the presence of grain boundaries plays a dominant role. The present study provides a new design mentality to fabricate stiffness‐adjustable alloys with low cost and high conductivity and enriches alloy species in LMPA‐HEAs.
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