干冰
干洗
污染
环境科学
湿法清洗
焊剂(冶金)
材料科学
污染
冶金
化学
废物管理
复合材料
工程类
生态学
有机化学
生物
作者
Zs. Tóth,Attila Lukács,István Szalai
出处
期刊:IOP conference series
[IOP Publishing]
日期:2022-08-01
卷期号:1246 (1): 012015-012015
被引量:4
标识
DOI:10.1088/1757-899x/1246/1/012015
摘要
Abstract Compared with routine methods, dry ice cleaning is an innovative, inexpensive and green technology, which efficiently cleans printed circuit boards (PCBs) and decreases levels of ionic contamination. Due to its outstanding performance, dry ice cleaning is suitable for removing flux residues. In this study, boards that have been artificially contaminated by flux were blasted by dry ice with different parameters. The influence of dry ice cleaning on different surface finishes was comprehensively investigated. It was shown that the efficiency of dry ice cleaning is comparable with other methods and is quantifiable. Furthermore, dry ice cleaning can effectively remove pollution on PCB surfaces, yielding a noticeable and ideal cleaning effect without decreasing the solderability of different surface finishes.
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