Spatiotemporal Measurement of Charge at Ceramic Substrate–Silicone Gel Interface in Medium-Voltage Power Modules

材料科学 陶瓷 基质(水族馆) 硅酮 接口(物质) 电压 光电子学 电气工程 电荷(物理) 功率(物理) 电子工程 复合材料 工程类 物理 海洋学 毛细管数 量子力学 毛细管作用 地质学
作者
Kaixuan Li,Boya Zhang,Ziyue Yang,Xinyu Jiang,Minghan Yao,Xingwen Li
出处
期刊:IEEE Transactions on Power Electronics [Institute of Electrical and Electronics Engineers]
卷期号:39 (12): 15360-15375 被引量:5
标识
DOI:10.1109/tpel.2024.3403480
摘要

With the proliferation of high-voltage, high-power density devices, insulation failure has emerged as a latent hazard in power modules. Notably, breakdown along ceramic substrate–silicone gel interfaces is a typical insulation failure process in power modules, necessitating particular attention and elucidation. Specifically, the charge movement characteristics that play a pivotal role in the failure process should be expounded. However, the lack of characterization methods currently renders these characteristics unclear. In this study, we proposed a method for the spatiotemporal measurement of the interfacial charge density between a direct-bonded copper ceramic and silicone gel. A reflective optical system was developed based on the Pockels effect to enable the measurement of nontransparent samples, such as encapsulation structures, in power modules. The measurement range of the optical system is ±20 kV. The interfacial charge density was calculated using an inversion algorithm. Charge dynamics at inaccessible interfaces were described for the first time. The threshold is ∼100 pC/mm 2 with 10-μs temporal and 27-μm spatial resolution. Compared with traditional methods, the proposed method stands out for its superior spatiotemporal dimensionality. Besides, it enables visual measurements, making it a solution for monitoring insulation status and diagnosing insulation defects specifically for encapsulation structures in power modules. The proposed method can help engineers improve the insulation design of power modules. This paper is accompanied by a video demonstrating the dynamic process of discharge.
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