材料科学
差示扫描量热法
热重分析
热稳定性
聚丙烯腈
玻璃化转变
复合材料
极限抗拉强度
傅里叶变换红外光谱
扫描电子显微镜
结晶度
聚合物
聚合物混合物
拉曼光谱
化学工程
光学
共聚物
物理
工程类
热力学
作者
Pratibha S. Jadhav,Girish M. Joshi,Rajendra R. Deshmukh
摘要
Abstract Polyacrylonitrile (PAN) polymer blends were more in demand due to their wide range of applications. We overcome the restricted low thermal stability and poor strength for deployable blend. In the present study, we prepared PAN and nitrocellulose (NC) polymer blends by solution casting method to overcome the low loss, low dielectric properties as alternative blend for cladding purpose in communication domain. C≡N bond exclusively demonstrated the impact on blending was confirmed by Fourier‐transform infrared spectrophotometer (FTIR) and Raman microscopy measurement. Semicrystalline nature of polymer blends as a function of NC loading was determined by X‐ray diffraction (XRD). Optical polarizing microscopy (OPM) and scanning electron microscopy (SEM) analysis illustrated an appearance of micro flocculated spherulites. Blending ratio of PAN/NC demonstrated the decreased direct band gap identified by Ultraviolet spectroscopy (UV). PAN/NC proved excellent alternative as low dielectric constant and low loss as cladding medium. Blending of NC with PAN exhibited an increased hydrophilicity was confirmed by surface goniometer. Increased thermal stability of polymer blends was mapped by thermogravimetric analysis (TGA). Blend melting temperature and glass transition temperature was increased from 322°C to 334°C and 88°C to 102°C confirmed by Differential scanning calorimetry (DSC) analysis. Thermal conductivity was increased from ~0.13 to ~0.34 W/m. k for PAN/NC determined by Lee's disc probe method. Mechanical properties of blends were measured using universal testing machine (UTM). Tensile strength and Young's modulus was increased up to ~23%, and ~ 56%, whereas elongation break was decreased up to ~71% for PAN/NC blends compared to host PAN system. PAN/NC may suit promising candidate as cladding blend for communication engineering due to low loss and low dielectric constant.
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