电子线路
集成电路
计算机科学
钥匙(锁)
电子工程
电气工程
工程类
计算机安全
操作系统
作者
Kaichen Zhu,Chao Wen,Areej Aljarb,Fei Xue,Xiangming Xu,Vincent Tung,Xixiang Zhang,Husam N. Alshareef,Mario Lanza
标识
DOI:10.1038/s41928-021-00672-z
摘要
Two-dimensional (2D) materials could potentially be used to develop advanced monolithic integrated circuits. However, despite impressive demonstrations of single devices and simple circuits—in some cases with performance superior to those of silicon-based circuits—reports on the fabrication of integrated circuits using 2D materials are limited and the creation of large-scale circuits remains in its infancy. Here we examine the development of integrated circuits based on 2D layered materials. We assess the most advanced circuits fabricated so far and explore the key challenges that need to be addressed to deliver highly scaled circuits. We also propose a roadmap for the future development of integrated circuits based on 2D layered materials. This Perspective examines the development of integrated circuits based on layered two-dimensional materials, exploring where they are likely to first find commercial use and considers the challenges than need to be addressed to create highly scaled circuits.
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