电容感应
微电子机械系统
材料科学
压力传感器
航空航天
微电子
有限元法
机械工程
制作
电容
纳米技术
数码产品
计算机科学
电子工程
电气工程
工程类
航空航天工程
电极
结构工程
医学
病理
物理化学
化学
替代医学
作者
Rishabh Mishra,Nazek El‐Atab,Aftab M. Hussain,Muhammad M. Hussain
标识
DOI:10.1002/admt.202001023
摘要
Abstract For decades, the revolution in design and fabrication methodology of flexible capacitive pressure sensors using various inorganic/organic materials has significantly enhanced the field of flexible and wearable electronics with a wide range of applications in aerospace, automobiles, marine environment, robotics, healthcare, and consumer/portable electronics. Mathematical modelling, finite element simulations, and unique fabrication strategies are utilized to fabricate diverse shapes of diaphragms, shells, and cantilevers which function in normal, touch, or double touch modes, operation principles inspired from microelectromechanical systems (MEMS) based capacitive pressure sensing techniques. The capacitive pressure sensing technique detects changes in capacitance due to the deformation/deflection of a pressure sensitive mechanical element that alters the separation gap of the capacitor. Due to advancement in state‐of‐the‐art fabrication technologies, the performance and properties of capacitive pressure sensors are enhanced. In this review paper, recent progress in flexible capacitive pressure sensing techniques in terms of design, materials, and fabrication strategies is reported. The mechanics and fabrication steps of paper‐based low‐cost MEMS/flexible devices are also broadly reported. Lastly, the applications of flexible capacitive pressure sensors, challenges, and future perspectives are discussed.
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