光电子学
材料科学
扇出
光子学
小型化
垂直腔面发射激光器
薄脆饼
光纤
基质(水族馆)
光开关
包装工程
光子集成电路
晶圆级封装
插入损耗
激光器
计算机科学
光学
工程类
电信
物理
地质学
纳米技术
海洋学
机械工程
作者
Hiroshi Uemura,Kaori Warabi,Kazuya Ohira,Yoichiro Kurita,Hideto Furuyama,Yoshiaki Sugizaki,Hideki Shibata
摘要
We propose a novel Si photonics module that overcomes the issues of conventional Si photonics modules such as package structure and electrical connection. The module incorporates an optical fiber socket fabricated by blind via socket (BVS) technology, which implements backside optical I/O in a photonic IC (PIC) by forming blind via holes on the backside. High-speed high-density electrical connection to both the PIC and an electrical IC (EIC) is also obtained in the module by fan-out wafer level packaging (FOWLP) technology. These technologies achieve a surface-mountable substrate-less fan-out optical module. It realizes a practicable integrated module of optoelectronic devices excellent in terms of electrical characteristics such as signal integrity (SI) and power integrity (PI), heat characteristics, and miniaturization. This paper presents a BVS module that enables optical coupling between a III-V/Si photodiode (PD) fabricated on a Si substrate and a multi-mode optical fiber by passive alignment of only insertion of the fiber into a blind via hole on the backside. High-speed optical signal transmission is also demonstrated with a fan-out optical module in which a BVS and an EIC are integrated by FOWLP and a vertical-cavity surface-emitting laser (VCSEL) or PD is mounted on the BVS.
科研通智能强力驱动
Strongly Powered by AbleSci AI