材料科学
复合材料
导电体
导电聚合物
聚合物
制作
热导率
电子设备和系统的热管理
热的
热传导
热固性聚合物
机械工程
气象学
病理
工程类
物理
替代医学
医学
作者
Shuaiqiang Yu,Miaoming Huang,Rui Hao,Suqin He,Hao Liu,Wentao Liu,Chengshen Zhu
标识
DOI:10.1177/09540083221106058
摘要
Polymer matrix composites (PMCs) with high thermal conductivity (TC) play an important role in improving the heat dissipation capacity of a new generation of electronic devices, particularly for 5G and aviation applications. Over the last few decades, considerable efforts have been made in the fabrication of highly thermally conductive PMCs. Advances in the thermal conduction mechanism of polymer composites are induced to, and then commonly used thermally conductive fillers are presented. In the following, the factors affecting the TC of polymer composites are discussed in detail, including fillers, interfaces, polymer matrices and processing technologies. Special attention is paid to the thermally conductive fillers. Then, some application areas of thermally conductive polymer composites are introduced. Finally, the deficiencies and future development trends in this research field are put forward. It is expected that this review will provide some beneficial inspiration in improving the TC of PMCs.
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