Mechanical properties of Sn–Pb based solder joints and fatigue life prediction of PBGA package structure

焊接 球栅阵列 材料科学 有限元法 焊接 复合材料 四平无引线包 电子包装 耐久性 冶金 结构工程 胶粘剂 工程类 图层(电子)
作者
Jintao He,Yun Ling,Lei Dong
出处
期刊:Ceramics International [Elsevier BV]
卷期号:49 (16): 27445-27456 被引量:4
标识
DOI:10.1016/j.ceramint.2023.06.017
摘要

Solder joints are generally the weakest part in electronic packaging structure whose fatigue life depends to a large extent on the durability of solder joints. In pursuit of a balance between environmental protection and soldering performance, commonly used Sn–Pb solder should be modified by adding other chemical elements to reduce Pb content. This work aims to investigate the performance of different solder materials and explore the impact of different electronic package structures. Firstly, tensile experiments are performed on three kinds of solders (Sn–Pb, Sn–Pb–In, Sn–Pb–Bi) to obtain their mechanical behavior, and then the constitutive laws of them are calibrated by Anand model. Additionally, finite element method (FEM) is used simulate the response of plastic ball grid array (PBGA) package structure under thermal cycles, and mechanical variables including deformation, equivalent stress, and equivalent strain are analyzed. Finally, Coffin-Manson and Engelmaier equations are adopted to predict the fatigue life of package structures and the effects of various factors such as solder materials, dimensions of components, and welding quality are further investigated. Results reveal that adding Bi into Sn–Pb solder can make the solder joints have better performance. From the perspective of optimum fatigue life, the plastic package thickness is recommended in the range of 0.8 mm–0.9 mm, the chip thickness is recommended as 0.35 mm, the substrate thickness is recommended to be less than 0.34 mm, and the ratio of stand-off height to solder ball diameter should be controlled between 0.6 and 0.7. According to the prediction, the solder ball diameter is suggested to be 0.54 mm so that fatigue life could reach 194 cycles, and the stand-off height for this package structure is suggested to be 0.36 mm so that fatigue life could reach 123 cycles.
最长约 10秒,即可获得该文献文件

科研通智能强力驱动
Strongly Powered by AbleSci AI
更新
PDF的下载单位、IP信息已删除 (2025-6-4)

科研通是完全免费的文献互助平台,具备全网最快的应助速度,最高的求助完成率。 对每一个文献求助,科研通都将尽心尽力,给求助人一个满意的交代。
实时播报
1秒前
1秒前
徐恭完成签到,获得积分10
2秒前
科目三应助肖沐采纳,获得10
2秒前
2秒前
CodeCraft应助周周采纳,获得10
2秒前
Rondab应助happy123采纳,获得30
2秒前
3秒前
3秒前
二三事发布了新的文献求助50
3秒前
现代的访曼应助luiii采纳,获得20
4秒前
5秒前
5秒前
5秒前
minever白完成签到,获得积分10
5秒前
5秒前
lili发布了新的文献求助10
5秒前
量子星尘发布了新的文献求助10
5秒前
6秒前
希望天下0贩的0应助杨瑞采纳,获得10
6秒前
OKAY发布了新的文献求助20
6秒前
彼阳的晚意完成签到,获得积分10
7秒前
mio发布了新的文献求助10
7秒前
iNk应助阮楷瑞采纳,获得10
8秒前
lizzy发布了新的文献求助10
8秒前
8秒前
樱悼柳雪发布了新的文献求助10
8秒前
赘婿应助SHD采纳,获得10
9秒前
9秒前
开朗道天完成签到 ,获得积分10
9秒前
Volta_zz发布了新的文献求助10
9秒前
林月发布了新的文献求助10
10秒前
HRB完成签到 ,获得积分10
10秒前
wjx发布了新的文献求助30
10秒前
zhuzihao发布了新的文献求助10
10秒前
俊逸的康乃馨关注了科研通微信公众号
10秒前
yyyyou发布了新的文献求助200
12秒前
周周发布了新的文献求助10
12秒前
fedehe完成签到 ,获得积分10
12秒前
MissYang完成签到,获得积分10
13秒前
高分求助中
Picture Books with Same-sex Parented Families: Unintentional Censorship 700
ACSM’s Guidelines for Exercise Testing and Prescription, 12th edition 500
Nucleophilic substitution in azasydnone-modified dinitroanisoles 500
不知道标题是什么 500
Indomethacinのヒトにおける経皮吸収 400
Phylogenetic study of the order Polydesmida (Myriapoda: Diplopoda) 370
Effective Learning and Mental Wellbeing 300
热门求助领域 (近24小时)
化学 材料科学 医学 生物 工程类 有机化学 生物化学 物理 内科学 纳米技术 计算机科学 化学工程 复合材料 遗传学 基因 物理化学 催化作用 冶金 细胞生物学 免疫学
热门帖子
关注 科研通微信公众号,转发送积分 3974856
求助须知:如何正确求助?哪些是违规求助? 3519400
关于积分的说明 11198085
捐赠科研通 3255563
什么是DOI,文献DOI怎么找? 1797860
邀请新用户注册赠送积分活动 877208
科研通“疑难数据库(出版商)”最低求助积分说明 806219