Manufacturing Equipment for Silicon Wafer

This chapter introduces 15 kinds of main silicon wafer manufacturing equipment, including Single Crystal Growth Furnace, Float Zone Crystal Growth Furnace, Ingot Grinding Machines, Slicing Machines, Silicon Wafer Annealing Furnaces, Edge Rounding Machines, Lapping Machines, Wafer Etching Machines, Polishers, Double-Side Grinders, Single-Side Grinders, Edge Polishers, Double-Side Polishers, Single-Side Polishers, and Final Cleaning Equipment. For each equipment, we briefly describe process function, basic principle, main structure, basic parameters, as well as main products in the market and their providers. The purpose is to give a general concept of the equipment to the readers who are directly or indirectly involved in the wafer manufacturing industry. Since the process flow for wafers equal to and less than 200 mm is different from that for 300 mm wafer, only the typical process flow is explained with annotations for processes implemented specifically by 300 mm equipment.