Additive-induced crystallization of highly (111) textured Cu nanotwins by electroless deposition

High-density Cu nanotwins in columnar grains were successfully fabricated within an electroless-deposited Cu film using a formaldehyde-based electroless plating solution. Such a structure was achieved by using a standard electroless plating process without high-speed stirring. Additives within the plating bath induced the crystallization of the nanotwinned structure in the reduced Cu atoms. In addition, the deposited Cu nanotwins comprised as high as 87% of the (111) textured orientation. The characteristics of the (111)-oriented Cu nanotwins and the advantages of the electroless deposition process indicate that this method is promising for future applications in the electronics industry.