Laser‐Based Fabrication Process Development for Flexible and Stretchable Electronics

制作 过程(计算) 数码产品 激光器 纳米技术 材料科学 可伸缩电子设备 工程类 计算机科学 电气工程 光学 物理 医学 替代医学 病理 操作系统
作者
Jung Jae Park,Minwoo Kim,Seung Hwan Ko
标识
DOI:10.1002/9783527842308.ch7
摘要

Soft electronics, as next-generation electronics, have been significantly researched due to their potential for a variety of applications in future electronics such as wearable devices, soft robots, healthcare monitoring devices, and human–machine interfaces. However, the fabrication of soft electronics by conventional manufacturing methods such as photolithographic patterning and vacuum deposition is challenging. This results from the incompatibility of the methods with soft materials that are commonly used for flexible and stretchable electronics. Also, the conventional fabrications limit the choice of materials and processing environments. Therefore, we focus on laser-based fabrication, as an alternative to the conventional methods, for soft electronics and introduce the process in terms of its representative types and various applications. First, representative laser-based fabrications including laser sintering, ablation, cutting, and hydrothermal growth are categorized and investigated. Then, we investigate prominent applications based on unusual structures, properties, and functionalities realized by laser fabrication. They include various soft electronic components and applications such as electronic circuits, sensors, heaters, actuators, and micro-channels. Lastly, perspectives on further applications integrated by laser-based processes are provided. We expect that the development of advanced soft electronics will be realized on the basis of a comprehensive understanding of the useful features of laser fabrication introduced in this review.
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