互连
串扰
碳纳米管
材料科学
电容电路
纳米尺度
光电子学
纳米技术
纳米电子学
电子工程
香料
电压
电气工程
计算机科学
工程类
电信
电容器
作者
Manoj Kumar Majumder,Nisarg D. Pandya,Brajesh Kumar Kaushik,S. K. Manhas
出处
期刊:IEEE Electron Device Letters
[Institute of Electrical and Electronics Engineers]
日期:2012-07-10
卷期号:33 (8): 1180-1182
被引量:63
标识
DOI:10.1109/led.2012.2200872
摘要
Multiwalled carbon nanotube (MWCNT) and bundled single-walled carbon nanotube (SWCNT) interconnect have provided potentially attractive solution in current deep submicrometer and nanoscale technology. This letter presents a comparative analysis between the MWCNT and the bundled SWCNT at different global interconnect lengths in terms of crosstalk-induced time delay and area by using a three-line-bus architecture. Each line of the bus architecture is replaced by the RLC models of the MWCNT and bundled-SWCNT interconnects. The crosstalk-induced time delay is predicted at the middle line (victim) when the other two lines (aggressors) are switched in the opposite direction. From HSPICE circuit simulation results, it has been observed that the overall improvement in the delay is 52.4% more for the MWCNT as compared with the equivalent bundled-SWCNT interconnects. Consequently, on an average, the MWCNT requires 97.8% lesser area as compared with the bundled-SWCNT interconnects for the same crosstalk-induced time delay.
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