Transient liquid-phase sintering using silver and tin powder mixture for die bonding

Abstract In this research, we develop transient liquid-phase bonding by uniaxial pressing using a Ag–Sn system. The Ag–Sn system was fabricated using Ag and Sn fine powder paste at optimized the proportions. The die bonding was performed for Cu substrates and metalized Si chips, and the sintering process was analyzed by cross-sectional observation. Die shear strength of bonded specimens was also measured. As a result, Ag–Sn completely formed a solid solution, also, Sn and Cu from substrates formed an intermetallic compound. The die shear strength was approximately 40 MPa obtained at 50 wt % Ag proportion of paste at 260, 280, and 300 °C sintering.