纳米线
材料科学
热导率
铜
复合材料
环氧树脂
电阻率和电导率
热的
纳米技术
冶金
电气工程
物理
工程类
气象学
作者
Kiho Kim,Kisang Ahn,Hyun Ju,Jooheon Kim
标识
DOI:10.1021/acs.iecr.5b04141
摘要
Copper nanowire/epoxy terminated poly(dimethylsiloxane) (ETDS) composites were prepared and used as thermal interface materials (TIMs). The surfaces of copper nanowire were coated with SiO2 to enhance their thermal and mechanical properties in the ETDS matrix. The thermal conductivity of CuNW/ETDS composites continuously increased with an increasing loading of CuNW filler. Moreover, at fixed particle loadings, an increased thermal conductivity was observed in surface-modified composites (CuNW@SiO2/ETDS). The effects of SiO2-coated copper nanowire were investigated using thermal conductivity prediction models. The storage modulus graphs illustrated the enhancement achieved by surface treatment of CuNW. In addition, the SiO2-coated copper nanowire composites showed decreased electrical conductivity as compared to the raw copper nanowire composites. Thus, these SiO2-coated copper nanowire/ETDS composites may be used as thermal interface materials in the electronics industry.
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