航空航天
航天器
结构材料
智能材料
材料科学
先进复合材料
形状记忆合金
复合材料
复合数
航空航天材料
电磁兼容性
计算机科学
热固性聚合物
航空航天工程
电气工程
工程类
作者
Steven Arzberger,Michael Tupper,Mark S. Lake,Rory Barrett,Kaushik Mallick,C. S. Hazelton,William H. Francis,Phillip N. Keller,Douglas Campbell,S. W. Feucht,D. E. Codell,Joe Wintergerst,Larry Adams,Joe Mallioux,Rob Denis,Karen L. White,Mark D. Long,N. A. Munshi,Ken Gall
摘要
The use of smart materials and multifunctional components has the potential to provide enhanced performance, improved economics, and reduced safety concerns for applications ranging from outer space to subterranean. Elastic Memory Composite (EMC) materials, based on shape memory polymers and used to produce multifunctional components and structures, are being developed and qualified for commercial use as deployable components and structures. EMC materials are similar to traditional fiber-reinforced composites except for the use of a thermoset shape memory resin that enables much higher packaging strains than traditional composites without damage to the fibers or the resin. This unique capability is being exploited in the development of very efficient EMC structural components for deployable spacecraft systems as well as capability enhancing components for use in other industries. The present paper is intended primarily to describe the transition of EMC materials as smart structure technologies into viable industrial and commercial products. Specifically, the paper discusses: 1) TEMBO EMC materials for deployable space/aerospace systems, 2) TEMBO EMC resins for terrestrial applications, 3) future generation EMC materials.
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