材料科学
背景(考古学)
半导体
薄脆饼
半导体工业
晶体管
纳米技术
工程物理
计算机科学
工艺工程
光电子学
电气工程
制造工程
工程类
古生物学
电压
生物
出处
期刊:Solid State Phenomena
日期:2018-08-01
卷期号:282: 3-9
被引量:5
标识
DOI:10.4028/www.scientific.net/ssp.282.3
摘要
The semiconductor industry is undergoing a transition driven by end use markets. In recent years, mobile devices have been the leading generator of growth. Now the connection of various products and machines to the internet is generating new and extensive demands for memory (storage of the data), logic (intelligent processing of the data including machine learning), and sensing (e.g., image sensors generating visual data). Thus the versatile planar MOS transistor based semiconductor technology has diverged into various specialized and complex branches, with each technology type using unique approaches to address scaling challenges. These lead to specific requirements for semiconductor wafer surface preparation. This paper will review the high level industry trends and how they affect surface preparation specifically.
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