材料科学
数码产品
薄脆饼
可穿戴技术
接口(物质)
转印
柔性电子器件
传输(计算)
可伸缩电子设备
图层(电子)
纳米技术
光电子学
可穿戴计算机
计算机硬件
计算机科学
嵌入式系统
电气工程
接触角
复合材料
工程类
并行计算
坐滴法
作者
Xin Liu,Yu Cao,Kunwei Zheng,Yingchao Zhang,Zhouheng Wang,Yihao Chen,Ying Chen,Yinji Ma,Xue Feng
标识
DOI:10.1002/adfm.202105407
摘要
Abstract Despite the increasingly significant role of flexible electronics in information, energy, and medical treatment, their integration with a special‐shaped interface remains an unresolved challenge. The traditional transfer method, as a core technology of device integration, is still unsuitable for thinned chips and 3D sensors. Solid‐contact elastomer stamp sometimes causes cracks while non‐contact method such as sacrificial layer method fails to achieve precise positioning transfer. Herein, the authors present liquid droplet stamp transfer printing (LSTP) with a high yield ratio which allows flexible devices to be transferred form silicon wafer to complex special‐shaped interfaces. Following the transfer scheme, the regulation of interface force is demonstrated with different thin‐film patterns. Besides, the liquid droplet stamp is designed as an efficient tool to transfer thinned inorganic flexible chips. A thinned micro light emitting diode, extensively used in large‐scale manufacturing of flexible circuits, is transferred and lighted successfully. In addition, a new method to fabricate 3D sensors is proposed with the liquid droplet stamp, which provides a new way of manufacturing wearable antenna and reconfigurable devices. Consequently, the LSTP has great potential for future sophisticated and system‐level flexible devices transfer printing and plays a vital role in the research of 3D flexible electronics.
科研通智能强力驱动
Strongly Powered by AbleSci AI