硅
光电子学
材料科学
薄脆饼
太阳能电池
量子点太阳电池
带隙
半导体
晶体硅
混合硅激光器
能量转换效率
单晶硅
聚合物太阳能电池
纳米技术
作者
Romain Cariou,Jan Benick,Frank Feldmann,Oliver Höhn,Hubert Hauser,Paul Beutel,Nasser Razek,Markus Wimplinger,Benedikt Bläsi,David Lackner,Martin Hermle,Gerald Siefer,Stefan W. Glunz,Andreas W. Bett,Frank Dimroth
出处
期刊:Nature Energy
[Nature Portfolio]
日期:2018-03-29
卷期号:3 (4): 326-333
被引量:291
标识
DOI:10.1038/s41560-018-0125-0
摘要
Silicon dominates the photovoltaic industry but the conversion efficiency of silicon single-junction solar cells is intrinsically constrained to 29.4%, and practically limited to around 27%. It is possible to overcome this limit by combining silicon with high-bandgap materials, such as III–V semiconductors, in a multi-junction device. Significant challenges associated with this material combination have hindered the development of highly efficient III–V/Si solar cells. Here, we demonstrate a III–V/Si cell reaching similar performances to standard III–V/Ge triple-junction solar cells. This device is fabricated using wafer bonding to permanently join a GaInP/GaAs top cell with a silicon bottom cell. The key issues of III–V/Si interface recombination and silicon's weak absorption are addressed using poly-silicon/SiOx passivating contacts and a novel rear-side diffraction grating for the silicon bottom cell. With these combined features, we demonstrate a two-terminal GaInP/GaAs//Si solar cell reaching a 1-sun AM1.5G conversion efficiency of 33.3%. As silicon solar cells are reaching their optimal efficiencies, below 30%, multi-junctions are being developed to increase the electrical power output over the same area. Here, Cariou et al. use wafer-bonding to fabricate two-terminal silicon III–V tandem cells that reach efficiencies above 33%.
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