可靠性(半导体)
航空电子设备
材料科学
数码产品
铝
电子元件
集成电路
温度循环
印刷电路板
集成电路封装
电力电子
电子包装
汽车工业
模具(集成电路)
电子工程
功率(物理)
电气工程
纳米技术
光电子学
工程类
复合材料
热的
航空航天工程
电压
物理
量子力学
气象学
作者
Andreas Lindemann,G. Strauch
出处
期刊:IEEE Transactions on Power Electronics
[Institute of Electrical and Electronics Engineers]
日期:2007-03-01
卷期号:22 (2): 384-391
被引量:31
标识
DOI:10.1109/tpel.2006.889898
摘要
Direct aluminum bonded (DAB) substrates have been developed. They can serve as isolating carriers especially for power electronic circuits or integrated components, respectively, using the standard assembly processes also applied to state of the art direct copper bonded (DCB) substrates. This new type of substrates has been characterized theoretically based on material properties of its layers and experimentally. While it behaves similar to DCB in many respects, the remarkably higher temperature cycling capability of DAB substrates constitutes a major difference, which is also useful to increase reliability of components exposed to extreme environmental temperatures. DAB based moulded integrated components with large chips in this respect have shown to reach a level of reliability which could not be achieved earlier with conventional technology. Outperforming the latter and complementing DCB, DAB can thus, in the future, be expected to explore new, and contribute to optimization of, existing applications with special demand for high reliability or also low weight. This makes this material well suited for use, e.g., in automotive power converters or avionic electronics
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